US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 7 for "Integrated semiconductor die parceling platforms" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,870, issued on Oct. 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated semiconductor die parceling platforms" was invented by Tsung-Sheng Kuo (Hsin-Chu, Taiwan), Hsu-Shui Liu (Pingjhen, Taiwan), Jiun-Rong Pai (Jhubei, Taiwan), Yang-Ann Chu (Hsin-Chu, Taiwan), Chieh-Chun Lin (Hsin-Chu, Taiwan) and Shine Chen (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel...