US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 7 for "Integrated packages having electrical devices and photonic devices and methods of manufacturing the same" (California Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,137, issued on Oct. 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated packages having electrical devices and photonic devices and methods of manufacturing the same" was invented by Chan-Hong Chern (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a photonic die having a first side and a second side opposite to each other. The semiconductor package includes an electrical die having a third side and a fourth side opposite to each other. The first side of the photonic die faces the third side of the electrical die. The photonic die has an index matching material...