US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 7 for "Chip package structure with redistribution layer having bonding portion" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,120, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip package structure with redistribution layer having bonding portion" was invented by Chih-Hang Tung (Hsinchu, Taiwan), Tung-Liang Shao (Hsinchu, Taiwan), Su-Chun Yang (Hsinchu County, Taiwan), Geng-Ming Chang (Taichung, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a first redistribution layer having a bonding portion. The bonding portion includes a dielectric layer. The chip package structure includes a chip structure bonded t...