ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,118, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Bonding tool and bonding method thereof" was invented by Chih-Yuan Chiu (Hsinchu County, Taiwan), Shih-Yen Chen (Hsinchu, Taiwan), Chi-Chun Peng (Hsinchu, Taiwan), Hong-Kun Chen (Hsinchu, Taiwan) and Hui-Ting Lin (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding tool and a bonding method are provided. The method includes attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a bending member movably arranged in a trench of the bonding tool, and the bending member protrude...