US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 28 for "Semiconductor arrangement and method of manufacture" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,759, issued on Oct. 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-chu, Taiwan).

"Semiconductor arrangement and method of manufacture" was invented by Hung-Te Lin (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor arrangement and method of manufacture is provided. In some embodiments, a semiconductor arrangement includes a collector region having a first surface coplanar with a first surface of a semiconductor layer, a drift region over a portion of the collector region and having a first surface coplanar with the first surface of the semiconductor layer, and a body region over the drift regio...