US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 28 for "Backside conductive segments cover a first active region and define an opening above a second active region" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,679, issued on Oct. 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd..

"Backside conductive segments cover a first active region and define an opening above a second active region" was invented by Te-Hsin Chiu (Hsinchu, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Taichung, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan) and Jiun-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes multiple backside conductive layers disposed over a backside of a substrate. The multiple backside conductive layers each includes conductive segments. The conductive segments in at least one of the ba...