US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 28 for "APR placement for hybrid sheet cells" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,801, issued on Oct. 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"APR placement for hybrid sheet cells" was invented by Kuan-Yu Chen (Hsinchu, Taiwan), Wei-Cheng Tzeng (Taipei, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Taichung, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device including first nanosheet structures each including a first number of nanosheets, second nanosheet structures each including a second number of nanosheets that is different than the first number of nanosheets, and a plurality of rows including first rows and second rows. W...