US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Trench filling through reflowing filling material" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,390, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Trench filling through reflowing filling material" was invented by Wen-Yen Chen (Hsinchu, Taiwan), Li-Ting Wang (Hsinchu, Taiwan), Wan-Chen Hsieh (Hsinchu, Taiwan), Bo-Cyuan Lu (New Taipei, Taiwan), Tai-Chun Huang (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first protruding fin and a second protruding fin over a base structure, with a trench located between the first protruding fin and the second protruding fin, depositing a trench-f...