US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Semiconductor package and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,396, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of forming same" was invented by Chen-Shien Chen (Zhubei, Taiwan), Ting-Hao Kuo (Hsinchu, Taiwan), Hsu-Hsien Chen (Hsinchu, Taiwan) and Yu-chih Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package includes attaching a first package component to a first carrier; attaching a second package component to the first carrier, the second package component laterally displaced from the first package component; attaching a third package component to the first packag...