US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,417, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Tzuan-Horng Liu (Taoyuan, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan) and Tsung-Yuan Yu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first tier and a second tier underlying the first tier and including TIVs and third dies. The first tier includes a first redistribution structure and first and second dies disposed side-by-side and separated by a first insulating encapsulation. A surface of the first...