ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,408, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structures" was invented by Pu Wang (Hsinchu, Taiwan), Chin-Fu Kao (Taipei, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a substrate, a first die, a second die, a first thermal conductive layer, a heat spreader and a second thermal conductive layer. The first die and the second die are bonded to the substrate. The first thermal conductive layer is inserted between the first die and the second die. The heat spreader is disposed on the substrate to cover the first die and...