US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 21 for "Methods for seam repair and semiconductor structure manufactured thereof" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,392, issued on Oct. 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods for seam repair and semiconductor structure manufactured thereof" was invented by Kenichi Sano (Hsinchu, Taiwan), Chin-Hsiang Lin (Hsinchu, Taiwan), Hsu-Kai Chang (Hsinchu, Taiwan) and Pinyen Lin (Rochester, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for repairing a seam within a conformally deposited material. One or more seam repairing precursor sources may be delivered to seams or voids using a carrier at a super critical fluid phase. At the super critical fluid phase, the carrier ha...