US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 21 for "Method of fabricating semiconductor devices having different architectures and semiconductor devices fabricated thereby" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,430, issued on Oct. 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of fabricating semiconductor devices having different architectures and semiconductor devices fabricated thereby" was invented by Chung-Hui Chen (Hsinchu, Taiwan), Cheng-Hsiang Hsieh (Hsinchu, Taiwan), Wan-Te Chen (Hsinchu, Taiwan), Tzu Ching Chang (Hsinchu, Taiwan), Wei Chih Chen (Hsinchu, Taiwan), Ruey-Bin Sheen (Hsinchu, Taiwan) and Chin-Ming Fu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device based on a dual-architecture-compatible design includes: forming transistor co...