US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Memory chiplet having multiple arrays of memory devices and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,105, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Memory chiplet having multiple arrays of memory devices and methods of forming the same" was invented by Chao-I Wu (Zhubei, Taiwan) and Yu-Ming Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A disclosed memory structure includes a first memory region including a first memory array of SRAM memory devices, a second memory region including a second memory array of 1T1C memory devices, and a third memory region including a third memory array of FeFET memory devices. The memory structure further includes at least one data bus later...