US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Low-noise package and method" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,438, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Low-noise package and method" was invented by Wen-Shiang Liao (Toufen Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first redistribution structure, an insulating material over the first redistribution structure, a die embedded in the insulating material, a second redistribution structure over the die and the insulating material, and a first via extending through the insulating material, wherein the first via includes a first inner conductive core, and a first outer conductive shielding layer, wherei...