US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Conductive traces in semiconductor devices and methods of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,426, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Conductive traces in semiconductor devices and methods of forming same" was invented by Chao-Wen Shih (Zhubei, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Han-Ping Pu (Taichung, Taiwan), Hsin-Yu Pan (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Sen-Kuei Hsu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the firs...