US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "3D stacking architecture through TSV and methods forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,435, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"3D stacking architecture through TSV and methods forming same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Jie Chen (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes joining a first wafer to a second wafer, forming a first through-via penetrating through the first wafer and further extending into the second wafer, and forming a redistribution line on the first wafer. The redistribution line and the first through-via electrically connect a first conductive feature in the f...