US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Workpiece handling system, method of calibrating workpiece handling system and method of manufacturing semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,633, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Workpiece handling system, method of calibrating workpiece handling system and method of manufacturing semiconductor package" was invented by Ta-Meng Kuan (Taoyuan, Taiwan), Yi-Neng Chang (Hsinchu County, Taiwan) and Ting-Yu Chiu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A workpiece handling system includes a carrier, a lower imaging device, and a transfer mechanism. The carrier is configured to carry at least one workpiece. The lower imaging device is disposed beside the carrier. The transfer mechanism is movably disp...