US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Test structures to determine integrated circuit bonding energies and methods of making and using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,742, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Test structures to determine integrated circuit bonding energies and methods of making and using the same" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Jyun-Lin Wu (Hsinchu, Taiwan), Yao-Chun Chuang (Hsinchu, Taiwan) and Chin-Fu Kao (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semicondu...