ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,714, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor structure" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Jie Chen (New Taipei, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Ching-Jung Yang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first die and a plurality of first dummy pads. The first die includes a first interconnect structure and a first active pad electrically connected to the first interconnect structure. The first dummy pads laterally surround the first active pad and are electrically floating."
The patent was f...