US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,663, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof" was invented by Meng-Liang Lin (Hsinchu, Taiwan), Po-Yao Chuang (Hsin-Chu, Taiwan), Te-Chi Wong (Hsinchu, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a ...