ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,665, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chun-Hui Yu (Hsinchu County, Taiwan), Jeng-Nan Hung (Taichung, Taiwan), Kuo-Chung Yee (Taoyuan, Taiwan) and Po-Fan Lin (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal c...