US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Photonic package and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,978, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic package and method of manufacture" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Hsing-Kuo Hsia (Jhubei, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Jiun Yi Wu (Zhongli, Taiwan), Hung-Yi Kuo (Taipei, Taiwan) and Shang-Yun Hou (Jubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes silicon waveguides on a first side of an oxide layer; photonic devices on the first side of the oxide layer, wherein the photonic devices are coupled to the silicon waveguides; redistribution structures over the first side of the oxide ...