US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Photonic integrated circuit and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,995, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic integrated circuit and package structure" was invented by Tsung-Yuan Yu (Taipei, Taiwan), Hung-Yi Kuo (Taipei, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Chung-Ming Weng (Taichung, Taiwan), Hua-Kuei Lin (Hsinchu, Taiwan) and Che-Hsiang Hsu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic integrated circuit has a central region and a peripheral region surrounding the central region. The photonic integrated circuit includes a semiconductor layer, a seal ring structure, and a plural...