ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,114, issued on Oct. 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Particle removal method" was invented by Chih-Yuan Yao (Hsinchu, Taiwan), Yu-Yu Chen (Taichung, Taiwan) and Hsiang-Lung Tsou (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A particle removal method includes loading a particle attracting member with a coating layer into a processing chamber of a processing apparatus. The processing chamber is configured to perform a lithography exposure process on a semiconductor wafer. The method also includes fixing the particle attracting member on a reticle holder in the processing chamber...