ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,696, issued on Oct. 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Package structure" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Che-Chia Yang (Taipei, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under th...