ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,706, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package bonding structures and method of formation" was invented by Kai Jun Zhan (Taoyuan, Taiwan), Chin-Fu Kao (Taipei, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan) and Chen-Shien Chen (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plura...