US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,719, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and manufacturing method thereof" was invented by Shing-Chao Chen (Hsinchu County, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan) and Sheng-Chieh Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a redistribution structure, a bridge die, conductive pillars, connectors, a first die, first solder joints, and second solder joints. The bridge die includes a substrate, a dielectric layer disposed on the substrate, and routing patterns embedded in the dielectric layer. The ...