US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 14 for "Methods and apparatus for reducing hydrogen permeation from lithographic tool" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,117, issued on Oct. 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods and apparatus for reducing hydrogen permeation from lithographic tool" was invented by Chi-Hung Liao (Hsinchu, Taiwan) and Po-Ming Shih (Sanchong, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for reducing hydrogen permeation of a mask is provided when generating extreme ultraviolet (EUV) radiation. The apparatus includes a mask stage configured to hold the mask, a hydrogen dispensing nozzle configured to eject hydrogen below the mask, and a trajectory correcting assembly. The trajectory correcting assembly include...