US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 14 for "Interconnect structure with vias extending through multiple dielectric layers" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,687, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interconnect structure with vias extending through multiple dielectric layers" was invented by Chun-Te Ho (Taipei, Taiwan), Ming-Chung Liang (Hsinchu, Taiwan), Chien-Chih Chiu (Xinying, Taiwan) and Chien-Han Chen (Nantou County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment includes a method. The method includes: forming a first conductive line over a substrate; depositing a first dielectric layer over the first conductive line; depositing a second dielectric layer over the first dielectric layer, the second dielectric layer ...