ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,240, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Interconnect layout for semiconductor device" was invented by Chun-Hsiung Tsai (Xinpu Township, Taiwan), Shahaji B. More (Hsinchu, Taiwan), Yu-Ming Lin (Hsinchu, Taiwan) and Clement Hsingjen Wann (Carmel, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a deep trench capacitor (DTC) having a portion within the substrate, and an interconnect structure over the DTC and the substrate. The interconnect structure includes a seal ring ...