US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 14 for "Apparatus and method for wafer bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,607, issued on Oct. 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus and method for wafer bonding" was invented by Yeong-Jyh Lin (Nantou County, Taiwan), Yeur-Luen Tu (Taichung, Taiwan) and Chin-Wei Liang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for wafer bonding includes a transfer module and a plasma module. The transfer module is configured to transfer a semiconductor wafer. The plasma module is configured to apply a first type of plasma to perform a reduction operation upon a surface of the semiconductor wafer at a temperature within a predetermined tempe...