US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Semiconductor structure with a laminated layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,095, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure with a laminated layer" was invented by Chia-Lin Chuang (Taoyuan, Taiwan), Chia-Hao Chang (Hsinchu, Taiwan), Sheng-Tsung Wang (Hsinchu, Taiwan), Lin-Yu Huang (Hsinchu, Taiwan), Tien-Lu Lin (Hsinchu, Taiwan), Yu-Ming Lin (Hsinchu, Taiwan) and Chih-Hao Wang (Baoshan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure. The structure includes a semiconductor substrate, a gate stack over a first portion of a top surface of the semiconductor substrate; and a lami...