US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Semiconductor structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,774, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for manufacturing the same" was invented by Kai-Hsuan Lee (Hsinchu, Taiwan), Shih-Che Lin (Hsinchu, Taiwan), Po-Yu Huang (Hsinchu, Taiwan), Shih-Chieh Wu (Hsinchu, Taiwan), I-Wen Wu (Hsinchu, Taiwan), Chen-Ming Lee (Taoyuan, Taiwan), Fu-Kai Yang (Hsinchu, Taiwan) and Mei-Yun Wang (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, nanostructures over the substrate, and a gate structure wrapping around the nanostructures. The gate structure includes a ...