US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Semiconductor processing tool and method of using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,454, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor processing tool and method of using the same" was invented by Tzu-Jung Pan (Hsinchu, Taiwan), Sheng-Kang Yu (Hsinchu, Taiwan), Shang-Chieh Chien (New Taipei, Taiwan), Heng-Hsin Liu (New Taipei, Taiwan) and Li-Jui Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plurality of hydrogen outlets are arrayed along a direction normal to a surface (such as a surface of a collector) of an extreme ultraviolet lithography (EUV) tool to increase a volume of hydrogen gas surrounding the surface. As a result, airborne tin is mo...