US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Semiconductor package including test line structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,099, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including test line structure" was invented by Tsung-Yang Hsieh (Taipei, Taiwan), Chien-Chang Lee (Miaoli County, Taiwan), Chia-Ping Lai (Hsinchu, Taiwan), Wen-Chung Lu (Hsinchu, Taiwan), Cheng-Kang Huang (Hsinchu, Taiwan), Mei-Shih Kuo (Hsinchu, Taiwan) and Alice Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprises an interposer, comprising an interposer substrate including at least one layer, and a plurality of RDLs formed through at least a portion of the interposer substrate. The package...