US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Semiconductor interconnection structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,134, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor interconnection structure and methods of forming the same" was invented by Shao-Kuan Lee (Kaohsiung, Taiwan), Kuang-Wei Yang (Hsinchu, Taiwan), Cherng-Shiaw Tsai (New Taipei, Taiwan), Cheng-Chin Lee (Taipei, Taiwan), Ting-Ya Lo (Hsinchu, Taiwan), Chi-Lin Teng (Taichung, Taiwan), Hsin-Yen Huang (New Taipei, Taiwan), Hsiao-Kang Chang (Hsinchu, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a...