US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Semiconductor die assembly having a polygonal linking die" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,178, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor die assembly having a polygonal linking die" was invented by Jen-Yuan Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die assembly is provided. The semiconductor die assembly includes: a first bottom die and a second bottom die disposed at a bottom vertical level; a first top die disposed at a top vertical level above the bottom vertical level in a vertical direction and bonded to the first bottom die; a second top die disposed at the top vertical level and bonded to the second bottom die; and a li...