US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Semiconductor device structure and method for forming the semiconductor device structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,789, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device structure and method for forming the semiconductor device structure" was invented by Wen-Yao Yang (Taoyuan, Taiwan), Chia-Wei Chen (Hsinchu, Taiwan), Wei-Cheng Hsu (Chiayi, Taiwan), Jo-Chun Hung (Hsinchu, Taiwan), Yung-Hsiang Chan (Taichung, Taiwan), Hui-Chi Chen (Zhudong Township, Hsinchu County, Taiwan), Yen-Ta Lin (Taipei, Taiwan), Te-Fu Yeh (Kaohsiung, Taiwan), Yun-Chen Wu (Hsinchu, Taiwan), Yen-Ju Chen (Hsinchu, Taiwan) and Chih-Ming Sun (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming...