US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,161, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Po-Yao Chuang (Hsinchu, Taiwan), Po-Hao Tsai (Zhongli, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and manufacturing process are provided wherein a first semiconductor device is electrically connected to redistribution structures. An antenna structure is located on an opposite side of the first semiconductor device from the redistribution structures, and electrical connections separate from the first semiconductor devi...