ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,108, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and manufacturing method thereof" was invented by Wen-Chih Chiou (Miaoli County, Taiwan), Ping-Yin Hsieh (Hsinchu, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan), Pu Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei, Taiwan), Yi-Huan Liao (Hsinchu, Taiwan) and Chih-Hao Chen (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a package structure, a thermal interface material (TIM) structure, and a lid structure. The package structure is disposed on the substrate. The TIM structur...