ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,786, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Jia-Ming Lin (Tainan, Taiwan), Shiu-Ko Jangjian (Tainan, Taiwan), Chun-Che Lin (Tainan, Taiwan), Ying-Lang Wang (Taichung, Taiwan), Wei-Ken Lin (Tainan, Taiwan) and Chuan-Pu Liu (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A structure of a semiconductor device includes a substrate, an isolation structure, and a liner layer. The isolation structure is embedded in the substrate. The isolation structure has a bottom surface and a sidewall. The liner layer is between the substrate and the isolation...