US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Redistribution lines having nano columns and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,169, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Redistribution lines having nano columns and method forming same" was invented by Po-Hao Tsai (Taoyuan, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Hsu-Lun Liu (Tainan, Taiwan), Kai-Di Wu (Tainan, Taiwan) and Su-Fei Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a seed layer over a first conductive feature of a wafer, forming a patterned plating mask on the seed layer, and plating a second conductive feature in an opening in the patterned plating mask. The plating includes p...