ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,067, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Pickup apparatus and method of using the same" was invented by Jen-Chun Liao (Taipei, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan), Hsiao-Chung Liang (Hsinchu, Taiwan) and Ying-Jui Huang (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between ...