ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,181, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Multi-wafer integration" was invented by Chin-Min Lin (Hsinchu, Taiwan), Hung-Jen Hsu (Taoyuan, Taiwan) and Dun-Nian Yaung (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafe...