US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,192, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier" was invented by Pei-Haw Tsao (Tai-chung, Taiwan), Chien-Li Kuo (Hsinchu, Taiwan) and Kuo-Chio Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an integrated circuit package includes: attaching a first carrier to a package component, the package component including: an interposer; a first semiconductor die attached to a first side of the interposer; a second semiconductor di...