US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Method and structure for overlay measurement in semiconductor device manufacturing" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,456, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method and structure for overlay measurement in semiconductor device manufacturing" was invented by Yen-Liang Chen (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an aspect of the present disclosure, in a method of manufacturing a semiconductor device, a lower layer pattern including first periodic patterns having a first pitch is formed, and an upper layer pattern including second periodic patterns having a second pitch different from the first pitch is formed. The first periodic patterns at least partially overlaps ...