US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Integrated circuit having hybrid sheet structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,086, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit having hybrid sheet structure" was invented by Shang-Wei Fang (Hsinchu, Taiwan), Kam-Tou Sio (Hsinchu, Taiwan), Wei-Cheng Lin (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan), Lee-Chung Lu (Hsinchu, Taiwan), Yi-Kan Cheng (Hsinchu, Taiwan) and Chung-Hsing Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) includes first through fourth nano-sheet structures extending in a first direction and having respective first through fourth widths along a second direction perpendicular to t...