US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Integrated chip including a device with a reduced surface field region" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,738, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip including a device with a reduced surface field region" was invented by Liang-Yu Su (Yunlin County, Taiwan), Chih-Wen Yao (Hsinchu, Taiwan), Hsiao-Chin Tuan (Ju Dong County, Taiwan) and Ming-Ta Lei (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated chip including a first doped region in a substrate and comprising a first doping type. A gate structure is over the first doped region. A pair of contact regions are in the substrate on opposing ...