US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Bonding with pre-deoxide process and apparatus for performing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,175, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding with pre-deoxide process and apparatus for performing the same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Ying-Jui Huang (Zhubei, Taiwan), Chih-Hang Tung (Hsinchu, Taiwan), Tung-Liang Shao (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chien Ling Hwang (Hsinchu, Taiwan), Yi-Li Hsiao (Hsinchu, Taiwan) and Su-Chun Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the f...